The 28th China Hi-Tech Fair · Asia AI Computing Power Industry & Data Center Exhibition focuses on intelligent computing infrastructure, liquid cooling technology and computing-electricity coordination. It gathers the whole industrial chain of computing power, data centers and emergency power supplies to jointly explore new opportunities for the development of green computing power.
VILVA will showcase its liquid cooling load bank test solutions!
##Application Scenarios
Performance calibration of single or clustered liquid cooling CDU, heat exchange efficiency verification of heat exchangers, and pipeline flow balance commissioning.
Full-load pressure test and voltage drop measurement of rack PDU, busbar, UPS and mains incoming line.
Joint heat dissipation simulation verification for cold/hot aisle containment, rear door air conditioners and in-row air conditioners.
Simulation of fault conditions such as liquid leakage, low flow, overtemperature and overload, to verify the reliability of BMS, pipeline sensors and interlock protection.
Pre-acceptance of GB200/GB300 computer rooms before commissioning and batch comparison testing of multiple racks, which greatly reduces the loss of real computing equipment and test costs.
Hybrid Fan-Liquid Cooled Load Bank Type
Liquid Cooling Load Bank
##Booth Information
Booth No.: 6-B46-1
Date: Nov 26–28, 2026
Venue: Shenzhen World Exhibition & Convention Center (Bao'an)
